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ACM/IEEE International Conference on Embedded Artificial Intelligence and Sensing Systems — 2027

May 17-20, 2027

Boulder, Colorado, United States

Sensors IoT Edge AI Edge Computing AI Systems Wireless Networks

Important Dates

Submission deadline     June 5, 2026 (closed)
Notification of acceptance     August 31, 2026 (passed)
CORE Ranking A*
Acceptance Rate 19.0% (2024 data)

SenSys 2027, now officially the ACM/IEEE International Conference on Embedded Artificial Intelligence and Sensing Systems, is a newly unified conference merging the former SenSys, IPSN, and related embedded sensing events into a single high-impact venue for research at the intersection of sensing systems and embedded artificial intelligence. The combined conference is co-sponsored by ACM and IEEE and welcomes papers, demos, and posters covering sensor networks and platforms, embedded and edge AI, mobile computing and wireless communications, signal processing and data science for sensor data, and the full stack of AI-driven sensing applications from hardware through system software to applications. The 2027 edition will be held in New York City and is co-located with CPS-IoT Week 2027. Paper submissions close June 5, 2026 (abstract registration May 29, 2026, AoE). Conference dates within 2027 have not yet been announced.

  For more information, visit the conference website

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